Monthly Archives: April 2013

Micro Vias: The Basics

For those of you wondering “what is all the fuss about micro vias”, we have put together a short list of “the basics”.

What is a Micro Via?

A blind connection between two layers, usually adjacent, hole of .006″ or less, typically drilled with laser technology.

Why use Micro Via Technology?

  • Fine pitch devices
  • Limited real estate
  • High levels of interconnect
  • Reduced hole sizes
  • Reduced pad sizes
  • More direct signal path
  • Improved reliability by changing technology rather than pushing older technology limits

Types of Micro Via constructions:

Staggered:  Micro Vias are staggered, or offset, from layer to layer

Stacked:  Micro Vias are “stacked” on top of each other.  This allows greater design density

Skip:  Micro Vias from L1-L3 rather than L1-L2, L2-L3.  This reduces the number of required lamination cycles

ELIC:  Every layer Inter Connect

Benefits of Micro Via Construction:

  • Smaller PCB’s
  • Improved electrical performance
  • Improved reliability
  • Thinner construction
  • Lighter weight
  • Space savings
  • RF line termination
  • Lower layer count

As always, please contact us for more information.  Designing and purchasing printed circuit boards should not be difficult!