Sub 1 Mil Line and Space

Breakthrough in fine line metallization

IC packaging and high end applications are driving the need for finer lines.  Conventional (subtractive etch) processing has a hard barrier at 25 micron resolution.  Omni PCB is now working with an additive approach that can achieve fine lines and thin copper, less than 10 microns.

Capabilities: 

  • ·         Fine line ( 5 microns) to wide line (250 microns)
  • ·         10 micron vias plated through
  • ·         Copper  thickness from .1 to 10.0 microns
  • ·         Substrates with thickness of 50,25, 12 microns or less
  • ·         Single circuits or panels of up to 18” x 24”
  • ·         Coat pre-drilled via walls

 

 What is it? 

  • ·         Truly Additive Metalization
  • ·         Print-and-Plate Copper Circuit Patterns
  • ·         On Thin Substrates
  • ·         True Adhesiveless Copper
  • ·         Fine Lines and Spaces
  • ·         Ultrathin Copper Capability
  • ·         Copper Thickness Made To Order

Contact us to learn more!!!    

http://www.omnipwb.com

Tara Dunn  507-332-9932  tarad@omnipcb.com  

Elizabeth Foradori  856-384-1300  elizabeth@omnipwb.com

 

 

 

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