Benefits of a fine line additive PCB process

The traditional subtractive etch process for manufacturing printed circuit boards becomes much less reliable when working with features that are sub 1 mil.  There has been a new additive process developed that uses a precursor ink to break through these barriers and meets four market needs:

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1.  Fine line (< 25 micron) Additive (Rigid and flex PCB)

  • Precursor ink makes the additive process practical
  • Additive process makes the fine lines practical
  • This process works well with existing manufacturing equipment
  • Cost savings over conventional processing can be 35%-60%

2.  Via excellence (Rigid PCB)

  • Precursor ink is the key advantage
  • Reduces electroless usage by 60% or more
  • Reduces the use of water by 60% or more
  • Lower cost than conventional processing

3.  Stacked microvia excellence (Rigid/Flex PCB)

  • Better results than conventional processing
  • Precursor ink is the key advantage
  • Eliminates the need for sequential lamination
  • Cost savings can be 20%-30%

4.  Selective via plating (Multilayer rigid PCB)

  • Precursor ink and ink blocker are the keys
  • Eliminates the need for sequential lamination processing
  • Cost savings can be 20%-60%

This process can be used as a stand-alone technology or in conjunction with the traditional subtractive etch process.  Please contact us if you are interested in learning more!

www.omnipcb.com

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