Tag Archives: electronics

Tips for Time Critical PCB’s

Can you relate to this common scenario? A quotation is received for the fabrication of three different PCB part numbers and a purchase order is placed for delivery in five days, on a time-critical project.

A few hours later, the dreaded email is received. There are questions regarding the design that are putting the project on hold. It takes a day, or possibly two, to coordinate the resolution of the questions between your customer, the PCB designer and the fabricator.

Next, you are informed that the delivery date for the PCB’s is pushed out for the two day delay in answering questions. Ugh! Now the schedule has to be adjusted, the components you paid a premium for will be sitting there waiting for the boards, and your customer is NOT happy.

This scenario occurs time and time again. Approximately 90% of designs that go through CAD/CAM at a PCB fabricator have questions that must be answered before the fabricator can start the board manufacturing. Some questions are minor and can be answered quickly; others can require a partial or complete redesign of the PCB.

Elizabeth Foradori and I sat down to discuss our thoughts and ideas on how to best work with PCB fabricators to reduce the likelihood of any delays during time-critical development of a new product.   Chapters could be written on this topic, but our hope is that these ideas provide a basis to encourage discussion early in the design process.

Prior to placing a purchase order:

Research and select your printed circuit board fabricator early in the process: If the design is going to be a standard design, on common material and fit neatly into any manufacturer’s “standard capabilities”, that makes things much easier. But, if the new design is going to be pushing the limits of standard technology in any way – microvias, fine line, tight pitch or tight tolerance, selective surface finish, exotic materials, rigid-flex – selecting a supplier early in the process, whose capabilities match the technology needed, will ensure that the design can be manufactured quickly once you are ready to release the files.

Involve the fabricator early in the design process: Ask questions. Talk to your supplier frequently during the design of the PCB. They encourage questions and are happy to make recommendations. Once the fabricator understands what you are trying to accomplish, they can make recommendations that will ensure that the design is manufacturable.   As a final step, or even an intermediate step during the design process, ask your fabricator to run a design rule check based on your files. This may not catch every issue and eliminate all engineering questions at the CAD/CAM stage, but it will catch the major issues that would require lengthy redesign once a project is released.

Verify that material is available and will be in stock when the design is complete:   Fabricators do try to stock the common materials and even small quantities of the less common materials to avoid delays. Unfortunately, they cannot stock all materials. Once the stack-up is finalized, ask the fabricator if this is material that will be in stock. If not, work with your supplier to pre-order the material to have in-house when you are ready to release the design. Some fabricators will secure material based on a simple email authorization; others will require a purchase order. Either way, planning for material to be in stock when the design is complete can save anywhere from five days to six weeks.

Once a purchase order is placed:

Send complete files: Review the files being submitted with the purchase order to ensure they are complete. Is the net list included? Are the fab notes complete, confirming any quality requirements, material specifications, and surface finish requirements? Do the fab notes match the gerber data?   These are all very common reasons that files are placed on engineering hold.

When you receive questions from the CAD/CAM tooling group, ask if this includes all questions associated with the design. Sometimes two different engineers may be working on the same design to meet an expedited delivery and both may have questions in their portion of the process. Other times, when the initial issues are encountered, the job is set aside only to find additional issues when work is resumed. The process can be streamlined by taking all questions to your designer or your end customer at one time.

If questions are fairly involved, it is always best to try to schedule a conference call between your fabricator, your designer or end customer and yourself to resolve the issue as quickly as possible. Email offers a great documentation trail for any changes, but can drag the process out longer than necessary. If communicating via conference call, ensure that someone is responsible for documenting the discussion and sending that to all parties involved.

Once the questions are answered, follow up with your supplier to confirm that the questions involved in the tooling process have not impacted your delivery schedule. Delays of a few hours are usually absorbed into the initial lead-time. Longer delays can impact delivery. PCB fabricators are typically very good about notifying customers of any changes in delivery date due to engineering questions, but it is always a good practice to ask. You don’t want to be surprised on the day you are expecting your printed circuit boards.

In summary, communication with your supplier is the best way to reduce the cycle time needed for fabrication of time-critical, new printed circuit board designs. Ask for recommendations during the design phase to ensure the design is manufacturable, verify that material will be available when the design is released, and if there are engineering questions, and communicate quickly to have those resolved.   Take advantage of the fabricators expertise and ask questions!

Contact us for further information!  www.omnipcb.com

Is it “Just a Board”?

I was out with friends one night, a table full of people holding many different conversations at one time. I clearly hear the words, “but it is just a board”.   The background noise dimmed and I suddenly became laser focused on that particular conversation.   I felt an adrenaline rush and the unstoppable need to defend the product I have chosen as my area of expertise.   I took a deep breath and calmly asked, “Why do you say that?” The result was a lively discussion about the function of the PCB in today’s electronics.

In fairness, this person’s background is in the component design side of the industry and his limited experience with PCB’s involved 2 and 4 layer, standard technology designs. So, yes, I get where he was coming from. You can buy a simple PCB at most shops and have good quality product. BUT, today’s electronics require the PCB to be so much more!

We are in a time of amazing developments in our electronics products. Electronics are required to be increasingly smaller, faster, lower power, lighter weight and feature rich. As consumers we can all appreciate this. The primary function of the PCB, other than being a solid base for components is to provide the interconnect between the components that are accomplishing these things.

Electronics today push PCB designs well past “standard technology”: specialty materials, finer lines and traces, microvias, both stacked and staggered, multiple lamination cycles, heat transfer, impedance matching, electromagnetic shielding, embedded components, etc. The phrase, “it is just a board”, just doesn’t apply.

PCB fabricators are continually developing new processes, pushing their technology limits and tightening process controls to meet these requirements. PCB designers need to understand the new materials, manufacturability constraints and cost drivers. The electrical, mechanical and fab people working together can create amazing things.

We rarely use this format to “get on our soap box”, but we are really curious……what does everyone think?

Is the PCB, “just a board”, or is it a critical aspect in the electronic assembly?

Send me a note and let me know you thoughts!   tarad@omnipcb.com

Polyimide Coverlay and Adhesive Squeezout

When a flexible circuit requires high dielectric or dynamic flexing, an adhesive coverlay film is often the best choice.

This coverlay film is traditionally a layer of adhesive bonded to a layer of polyimide. During processing, heat and pressure are applied to the stack up causing the adhesive to soften and flow.   The adhesive will flow (squeeze-out) slightly beyond the coverlay openings.

This process is necessary for complete encapsulation of the coverlay and to protect the edges of the film from chemicals or abrasion which might cause delamination.

Although this is a desirable result of bonding the coverlay, this “adhesive squeeze-out” also reduces the solderable area of the coverlay opening, and must be accounted for in the design stage.

We are often asked what an acceptable amount of adhesive squeeze-out is. According to IPC-A-600, the coverlay coverage shall have the same requirements as the soldermask coverage in rigid printed circuit boards. The acceptability requirements for coverlay coverage include both the coverlay and the squeeze out of adhesive and are different based on which Class is being built to.

For example, Class 3 requires 0.05 mm (0.00197”) solderable annular ring for 360 degrees of the circumference. Class 2 requires this same solderable annular ring for 270 degrees of the circumference and Class 1 requires a solderable annular ring for 270 degrees of the circumference.

We always recommend involving your supplier in the early stages of the flexible circuit design. An experienced flex circuit engineering will be able to guide you to the correct material stack up and tolerances needed to ensure you receive the product you require.

Please contact us for additional information.  Designing printed circuit boards should not be difficult! 

www.omnipcb.com

Ormet Paste – Making Z-Axis connections during lamination

Paste instead of plating ~ something to think about…..
We have been part of several discussions recently regarding Ormet paste and thought others might be interested as well.

Ormet Paste is a product that has been around for a while and it seems that the market is just starting to catch up with the technology.

These products can be used for several different applications, but today we are focusing on using the product to make Z-axis connections during lamination.

In other words, the Ormet Paste 700 series materials allow you interconnect electrically while bonding layers mechanically.

Possible Applications:
Thick boards – layer reduction: 

  • Overall thickness reduction; reduction of aspect ratio by splitting a board into separate builds and joining with Ormet paste which can improve plating and drilling quality.
  • Elimination of back drilling and/or flip drilling

High Speed Cap – Mixed Dielectric Builds:

  • No hole plating of high speed layers.
  • Separate fabrication of high speed layers results in smoother outlayer surface resulting in improved RF performance.

“Any Layer” HDI using Paste:

  • Z-axis conductors applied prior to lamination.
  • Paste interconnects used to connect 2-layer cores in a single process step)

Why is Ormet Paste Different?

Transient Liquid Phase Sintering – Compositions comprising powder metallurgy (90% by weight) mixed in particulate form.

 During thermal processing:

  • The alloy becomes molten and reacts with metal to form new alloy compositions and/or intermetallic compounds
  • This reaction continues until one of the reactants is fully depleted (reaction starts at 150C, normal lamination temperatures).
  • This is unlike most silver pastes which are held together by the polymer.
  • This also forms a metallurgical bond with metals it comes in contact with.

Ormet does not cure, it sinters into a metal mass.

This is very basic information taken from the Ormet literature.  If you are interested in more detailed information, please let us know.  Contact information is included below.

Remember, designing and purchasing printed circuit boards does not have to be difficult!
Tara Dunn – tarad@omnipcb.com – 507-332-9932
Elizabeth Foradori – elizabeth@omnipwb.com – 856-802-1300

PCB Specialist or Generalist? Just a thought.

For regular medical checkups we go to a General Practitioner, for a specific health issue or surgery, we see a specialist.  One is a “Jack or Jill of all trades”, the other, the master of a small area of expertise.    I think you can find similar situations in many industries; retail, law and automobile repair easily come to mind.

Can we draw a parallel in the PCB industry?  When a design uses standard technology, 2-16 layers, class 2 and standard tolerances, many have a list of PCB suppliers they competitively bid and make their decisions based on price, lead-time and ease of doing business.

On the other hand, when you have a flex or rigid flex design, 5+ layers of stacked, copper filled micro vias, or a design with highly specialized RF materials, you search out a facility regarded as an industry expert to meet that very specialized need.

In today’s world of downsizing, time crunches and reduced AVL’s, many are drawn to the larger industry players with multiple facilities, each with a “specialty” that allows a solution to nearly any requirement.    This strategy works well with “larger” PCB users.  Unfortunately, for a mid-size or small company it is very easy to “get lost in the shuffle” with the large PCB manufacturers.  Service is not at all personalized to your needs, there is not a lot of flexibility and you can easily get the sense that your business is just not that important.

Omni PCB provides a solution.   Our customers enjoy one point of contact for both “general” needs AND more specialized requirements.   We specialize in printed circuit boards and represent companies that have complimentary capabilities.   We represent suppliers that offer cost competitive standard technology and suppliers that are specialists in their chosen technology area.   We can recommend the best fit solution for each requirement based on each customer’s unique needs.  Not only does each facility we represent offer great service and flexibility, Omni PCB adds our own level of customer service to ensure our customers have the best experience possible.

Maybe in the PCB world, you do not need to “visit” two different types of suppliers.  Maybe one contact can fit ALL of your needs.

I welcome your thoughts!

www.omnipcb.com

Price Considerations for Flexible Circuit Design

For the most part, designers understand what types of constructions and design attributes are “non-standard” and add cost to their design.  Flex circuit and rigid flex design is similar with a few “odd ball” factors thrown in.  We have compiled a short list of design attributes and how they impact cost.  For more detailed information on costs or for a free copy of our design guide, please contact us!

 Low Cost Factors:

  • Complex routing and scoring
  • Edge routing
  • Strain relief
  • LF vs AP materials

 Medium Cost Factors:

  • Aspect ratio > 10:1
  • Drill hole count > 30K
  • Non-FR4 material in the rigid areas
  • Drilled holes < .012”
  • Stiffeners (rigidizers)
  • Added tear stops
  • Line width and space < .005”
  • Button plating
  • Controlled impedance
  • Annular ring (pad < drill + 12)

 High Cost Factors:

  • Advanced technologies
  • Buried vias
  • Layer count
  • Material utilization
  • Selective plating
  • Buried access (ZIF connectors)
  • Line width and space  < .004”

 Cost Trade Offs:  general rule of thumb 

  • Use smaller line width/space before adding layers
  • Investigate how the boards will fit in the production panel for material untilization
    • do not forget about nesting flex or straightening a bend and folding after parts are removed from the panel
    • LF materials are lower cost than AP materials, but the increase in acrylic resin in a via stack can reduce reliability due to an excessive CTE-Z

 Involve your PCB supply chain partner early in the design phase to ensure the most reliable, cost effective design that will meet your specific requirements!

www.omnipcb.com