Tag Archives: pcb materials

Ormet Paste – Making Z-Axis connections during lamination

Paste instead of plating ~ something to think about…..
We have been part of several discussions recently regarding Ormet paste and thought others might be interested as well.

Ormet Paste is a product that has been around for a while and it seems that the market is just starting to catch up with the technology.

These products can be used for several different applications, but today we are focusing on using the product to make Z-axis connections during lamination.

In other words, the Ormet Paste 700 series materials allow you interconnect electrically while bonding layers mechanically.

Possible Applications:
Thick boards – layer reduction: 

  • Overall thickness reduction; reduction of aspect ratio by splitting a board into separate builds and joining with Ormet paste which can improve plating and drilling quality.
  • Elimination of back drilling and/or flip drilling

High Speed Cap – Mixed Dielectric Builds:

  • No hole plating of high speed layers.
  • Separate fabrication of high speed layers results in smoother outlayer surface resulting in improved RF performance.

“Any Layer” HDI using Paste:

  • Z-axis conductors applied prior to lamination.
  • Paste interconnects used to connect 2-layer cores in a single process step)

Why is Ormet Paste Different?

Transient Liquid Phase Sintering – Compositions comprising powder metallurgy (90% by weight) mixed in particulate form.

 During thermal processing:

  • The alloy becomes molten and reacts with metal to form new alloy compositions and/or intermetallic compounds
  • This reaction continues until one of the reactants is fully depleted (reaction starts at 150C, normal lamination temperatures).
  • This is unlike most silver pastes which are held together by the polymer.
  • This also forms a metallurgical bond with metals it comes in contact with.

Ormet does not cure, it sinters into a metal mass.

This is very basic information taken from the Ormet literature.  If you are interested in more detailed information, please let us know.  Contact information is included below.

Remember, designing and purchasing printed circuit boards does not have to be difficult!
Tara Dunn – tarad@omnipcb.com – 507-332-9932
Elizabeth Foradori – elizabeth@omnipwb.com – 856-802-1300

I-Speed and I-Tera Material

New Materials have been released from Isola.  A brief summary is included below, but please contact us if you would like additional information!

I-Speed  ~ Next generation low loss and lead free laminates and pre-pregs for HSD Applications

I-Tera ~ Next Generation Low Loss for RF/Microwave, High Speed Digital and Hybrid Designs

As a quick summary:

I-Speed Benefits:

  • 15-20% more bandwidth than FR408HR when tested using industry-standard
    SI TVs
    • Cisco S3 – 20% @ 10 GHz
    • IBM SPP – 15% @ 20 GHz
    • Intel SET2DIL – 17%  @ 8 GHz
  •   More Thermally Robust than FR408HR
    • 15X Reflow  @ 260°C (as received) on 28-layer build  with 4 2oz I/Ls & 0.135”
    • 10X Reflow  @ 260°C (after 35/85/336 conditioning) on 28-layer build
  •   Spread Glass Offerings (1035, 1078, 1067, 1086 & 3313)
    • Mitigates micro-Dk effects
    • Reduces skew
    • Improves CAF
    • Improves laser ablation & mechanical drilling for HDI applications
  •   Enhanced performance on 0.8mm pitch applications
  •   Improved HDI performance over FR408HR
  •   VLP-2 (2 micron roughness) copper at no additional cost
  •   Currently priced below FR408HR


 I-Tera Product Strengths:

  •   I-Tera MT uses Standard E-Glass
  •   Standard Thicknesses Available (nominal ± 5% for 0.020” and above)
  •   Full Thin core offering from 0.0020 ( non ZBC ) to 0.018” for multilayer designs
  •   I-Tera MT 0.020”, 0.030” & 0.060” will be available for multilayer designs
  •   Standard Prepreg glass styles available  
  •   Square and MS Spread glass weaves used – 1035, 1067, 1086, 1078
  •   Very Low Loss material for backplane, high data rate daughter cards, hybrid applications
  •   Superior Drilling Performance – I-Tera MT does not contain a ceramic filler  
  •   Processing to date – Plasma desmear not required 
  •   No issues with ENIG in testing to date.                      
  •   Compatible with Isola 185HR, 370HR and IS415 for hybrid constructions
  •   I-Tera MT prepreg can be stored at standard FR4 conditions
  •   I-Tera MT = UL 94 V- 0 
  •   UL MOT 130 C , I-Tera MT is the UL designation  

 Contact us for additional information!  www.omnipcb.com    tarad@omnipcb.com