Ormet Paste is a product that has been around for a while and it seems that the market is just starting to catch up with the technology.
These products can be used for several different applications, but today we are focusing on using the product to make Z-axis connections during lamination.
In other words, the Ormet Paste 700 series materials allow you interconnect electrically while bonding layers mechanically.
Thick boards – layer reduction:
- Overall thickness reduction; reduction of aspect ratio by splitting a board into separate builds and joining with Ormet paste which can improve plating and drilling quality.
- Elimination of back drilling and/or flip drilling
High Speed Cap – Mixed Dielectric Builds:
- No hole plating of high speed layers.
- Separate fabrication of high speed layers results in smoother outlayer surface resulting in improved RF performance.
“Any Layer” HDI using Paste:
- Z-axis conductors applied prior to lamination.
- Paste interconnects used to connect 2-layer cores in a single process step)
Why is Ormet Paste Different?
Transient Liquid Phase Sintering – Compositions comprising powder metallurgy (90% by weight) mixed in particulate form.
During thermal processing:
- The alloy becomes molten and reacts with metal to form new alloy compositions and/or intermetallic compounds
- This reaction continues until one of the reactants is fully depleted (reaction starts at 150C, normal lamination temperatures).
- This is unlike most silver pastes which are held together by the polymer.
- This also forms a metallurgical bond with metals it comes in contact with.
Ormet does not cure, it sinters into a metal mass.
This is very basic information taken from the Ormet literature. If you are interested in more detailed information, please let us know. Contact information is included below.